配置進(jìn)口多軸晶圓搬運機械手臂

可以應(yīng)對更薄的晶圓進(jìn)行切割膜的貼膜

晶圓位置和翹曲智能反饋

17英寸觸摸屏液晶工業(yè)電腦控制

貼膜動作：全自動拉膜和貼膜，收廢膜

Wafer Thickness

80 ~ 750 um

Wafer material

Si, SiC

Wafer Type

Single Flat, Double Flat or V-Notch

Tape Type

Blue Tape or UV Tape

Width :230、300 mm, Length:100 m; Thickness: 0.05 ~ 0.2 mm

Frame Type

6" DISCO or K&S, 8" DISCO or K&S; or Customer Specified

Mounting Theory

Vacuum Mounting

Wafer Place Accuracy

X-Y: +/- 0. 1 mm    Θ: +/- 0.1°

Input & Output

Dual Input Wafer Cassette / Single Output Frame Cassette

ESD Control

ESD Roller / ESD Wafer Chuck / ESD Ion Blower

Wafer Transfer

Horizontal Multi Axis Robot with Vacuum or Bernoulli Endeffector

Wafer Position & Warpage Intelligent Mapping in Cassette

Wafer Alignment

Fiber Sensor for Wafer Alignment

Control Unit

Standard Industrial PC with 17" Touch Panel LCD / Windows O/S

Power Supplier

Single Phase AC 220 V, 25A

Air Supplier

5.0 Kgf/cm2 CDA, 150 L/min

Machine Construction

Made of Full Aluminium Profile

Dimensions

1750 mm (W) × 1350 mm (D) × 1800 mm (H)

Net Weight

870 Kg